 |
Innovative X Y axis
adjustment method that simplifies the
complex steps of focusing/positioning the
BGA in the PCB. |
|
Microprocessor controlled
with full digital display of time,
temperature and airflow parameters for
maximum performance |
|
Uses split vision technology. |
|
Equipped with high precision
optimizer that has dependable accuracy. |
|
Precision solder. Lessen the distortion of
PCB due to heat. Probability of repair
repetition is lower. |
|
Uses infrared heat wave technology instead
of the conventional hot air,
effectively solves the major problem being
encountered when using the hot air gun,
which is the movement of surrounding
components while reworking. |
|
Designed for both lead-free and standard
solders. |
|
Versatile PCB holder that has board capacity
of up to 280 X 430mm. |
