For encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired.
Bonds to a wide variety of substrates, including metals, glass, ceramics and many plastics.
Extremely difficult to remove - grants incredible technology protection
Extreme physical strength and chemical resistance Suitable for extreme environments, such as submersion in salt water, acids, bases, fuels, and alcohols Protects against strong vibrations, abrasions, and direct physical impact
Makes 375 mL
Maximum service temperature of 27 C (527 F)
Typical Applications: Use in electronic assemblies to prevent vibration damage Encapsulate circuits for the purpose of technological protection