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Potting Compounds

Potting and encapsulating compounds provide supreme protection from water, chemicals, shock, voltage discharge, vibration, and physical damage. They are extremely difficult to remove, generally making rework impossible, but which also imparts technology protection, making reverse engineering much more difficult. Potting a device in epoxy brings challenges, however. Plain epoxy will trap heat and be a flammability risk, so the formulation of a good potting compound revolves around solving these two issues. Formulators seek to maximize thermal conductivity while meeting regulatory flame retardant requirements, while still providing a product with good flow and wide operating temperature range, always using the latest technology available. The additives, pigments, and resins available to the formulator are constantly evolving, and he must keep abreast of these changes to ensure his products are the best available.
  1. Part No:MG832HT-375ML
    For encapsulating and potting electronics in high temperature environments, aggressive chemical environments,
  2. Part No:MG832TC-450ML
    Formulated with undiluted Bis F resin for superior physical properties, and pigmented with high purity aluminum oxide pigment
  3. Part No:MG833FRB-375ML
    A two component self extinguishing epoxy compound.
  4. Part No:MG832B-375ML
    For high voltage applications
  5. Part No:MG832C-375ML
    Protects sensitive electronic components from impact, shock, vibration, heat, conductivity, moisture, chemicals.
  6. Part No:MG8329-350G
    Apply this release to a surface before pouring in encapsulating and potting compound
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