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MG Chemicals Wire Solder 4900-35G SAC 305 No-Clean Core. 032, 35 Grams

Part No:MG4900-35G

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Quick overview

Wire SAC 305 No-Clean Core. 032, 35 grams




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    Key Features
  • M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.
  • Use this solder anywhere you would use normal solder.
  • Lead free Complies with RoHS Exceeds the impurity requirements of J-Std-006
  • No Clean flux
  • 21 Gauge, 0.032" diameter
  • Excellent wettability
  • Hard non-conductive residues

These alloys conform to the impurity requirements of J-Std-006 and RoHS.

1 lb of lead free solder has 27% more length than leaded solder Flux Percentage

M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder.

The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire.

Typical flux percentage for our Lead Free Solder is 2.0-4.0%.

Flux Core: A unique flux system was specifically used for high temperature lead free alloys.

It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type.

This special activator exhibits virtually no spattering.

Activator conforms to J-STD-004, REL0. Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications.

Additional Information
SKU MG4900-35G
Weight (lbs) 0.25
Free Shipping No
Brand MG Chemicals
UPC 779008490006
Manufacturer MG Chemicals
Diameter(Inches) .031
Flux Type No Clean
Contains Lead Lead Free
Application Electronics
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