MG Chemicals 9200 Structural Adhesive, 25 mL Dual Syringe

Key Features
• Toughened, smooth, thixotropic paste
• 1:1 mix ratio
• Working life: 30 minutes
• Cure time: 24 hours at room temperature
• Non-sagging and gap filling
• Very strong adhesion
• Bonds dissimilar materials
• Highly resistant to vibration and temperature cycling
• Extreme chemical resistance
• Low shrinkage
• Easy to dispense

The 9200 Structural Epoxy Adhesive is a two-part, thixotropic, toughened adhesive that is designed to create load bearing joints. It offers excellent adhesion to a wide range of difficult to bond to materials, including glass, ceramics, metals, engineered thermoplastics, and thermoset laminates such as SMC (sheet molding compound) and GRP (glass-reinforced plastics). The toughened adhesive protects against vibration damage when fully cured, but remains sufficiently flexible to accommodate thermal cycling stresses when bonding materials with different coefficients of thermal expansion. The 9200 is electrically insulating and chemically resistant, which helps prevent corrosion damage. It has an excellent chemical resistance to moisture, salt water, detergents, gasoline, hydraulic fluids, antifreeze, automotive fluids, acids, and bases. In addition, dissimilar metals can be bonded together without fear of causing galvanic corrosion because the adhesive prevents current flow through the bond. Applications & Usages This adhesive is primarily used for creating long lasting load bearing joints, especially in situations where vibration resistance is key or where dissimilar materials are being joined. It is especially suitable for sheet molding compound (SMC) and glass-reinforced plastics (GRP) bonding. It is thixotropic, which makes it a great gap filler and is sag resistant—perfect for use on vertical surfaces. It is also excellent for potting electronics, especially when the enclosure has holes or seams where a nonthixotropic potting compound would flow through. It provides superior environmental protection and performs very well under temperature cycling.