Very long shelf life of at least two years, even when stored at room temperature
Easy 1:1 mix ratio
Excellent thermal conductivity
The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity.
It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature.
The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.
Adheres to most electronic substrates
Stores and ships at slightly below room temperature
Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons-