The 8329TCS Slow Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines long working time and high conductivity with ease of use.
It has a convenient 1-to-1 mix ratio and 4 hours pot life. Due to this long pot life, the mixed adhesive essentially behaves like a 1-part adhesive for the duration of a work shift. However, unlike 1-part adhesives, it doesn't require temperatures as high as 130 and 170 C, and it will cure at a more moderate 80C in less than 1 hour.
The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks. Good low temperature alternative to 1-part TC adhesives with inconveniently high cure temperature
Excellent 1.44 W/(mK) thermal conductivity
Easy 1:1 mix ratio
Adheres to most electronic substrates
Stores and ships at slightly below room temperature no freezing or dry ice required
Very long shelf life of at least three years even when stored at room temperature
Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons-