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This two part silver epoxy offers extreme electrical conductivity and strong conductive bonding.
Use in place of traditional soldering on heat sensitive components.
Good for repairing defective traces and creating jumpers on boards.
Can be used as an effective heat sink adhesive.
Minimum operating temp. -40 °C ( -40 °F )
Maximum operating temp. 150 °C ( 302 °F )
Cure time @ 25 °C (77 °F) 96 hours Cure time @ 65 °C (149 °F) 60 minutes
Working time @ 22 °C 4 HoursVolume resistivity @ 25 °C 0.007 ohm cm
Tensile strength 911 psi
Elongation 0.3 %
Compressive Strength 1100 psi
Flexural Strength 9,369 psi
Tensile Strength 13.5 MPa
Bonds to glass, ceramics, metals, plastics, aluminum, bronze, magnesium, kovar, nickel and printed circuits boards.
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