Excellent thickness distribution and throwing power
Easy to manage and control the processes
High plating rate for fast production
Smooth and compact surface deposits up to 20 micron thickness
Range of colors: 18Kt-24Kt
Low specific gravity of the gold deposits
High range of current density
This process provides a smooth and shinny 22-24 karat gold electroplating deposit, with high hardness, corrosion and wears resistance. This is use for Heavy Gold plating and also known as Micro gold plating.
K22 contains 5 grams of fine gold in every liter of plating solution. Most gold plating baths contain between 0.5-1.5 grams of gold per liter of plating solution. The high content of gold in K22 provides the capability to plate up to 100 times thicker than the standard gold plating bath, presently in the market place.
Our key product areas include Brazing and Soldering Alloys in Paste and Wire, Metrology Tools, Digital Readout Systems, Soldering Stations, Electroplating, Ultrasonic cleaning, Machine Tapping Tools and Hand Tools.
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